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SOLDERING PRACTICE:
SOLDER ALLOYS & TEMPERATURES

SOLDER ALLOYS AND AVAILABLE FORMS

ALLOY MELTING RANGE AVAILABLE FORMS  
TIN-LEAD ÁF ÁC WIRE BAR SOLDER
PASTE
SOLDER
FORMS
RECOMMENDED USE
Sn63Pb37 361 183 X X X X Most common, tin-lead eutectic used in PCB assembly applications.
Sn60Pb40 361-374 183-190 X X   X Used in single sided board soldering and solder dipping operations.
Sn55Pb45 361-374 183-203 X X   X Not commonly used, solder for high temperature solder dipping operations.
Sn50Pb50 361-397 183-214 X X   X Intended use for bit soldering and sweat soldering iron, steel, and copper.
Sn40Pb60 361-420 183-238 X X   X Higher temperature applications, common in automobile radiator soldering.
Sn30Pb37 361-460 183-258 X X   X Use as automotive body solder for filling dents.
No. 123 366-496 186-262 X X     Low drossing alloy used in high temperature wire tinning operations.
Sn20Pb80 361-503 183-280 X X   X Not commonly used, solder for automotive body or radiator work.
Sn10Pb90 514-536 268-302 X X   X Alloy of choice for solder spheres and columns used in BGA/CGA fabrication.
Sn05Pn95 574-576 301-314       X High temperature alloy used infrequently in special applications.
LEAD-FREE              
Sn96.5Ag3.5 430 221 X X X X High temperature, eutectic alloy provides high joint strength.
Sn96Ag04 430-444 221-229 X X   X This alloy is used in applications where high joint strength is required.
Sn95Ag05 430-473 221-245 X X   X This alloy is used in applications where high joint strength is required.
100%Sn 450 232 X X   X Sometimes referred to as Sn99, is used for making tin additions to solder pots.
Sn95Sn05 450-464 232-240 X X   X For applications where connections see peak temperatures near 400ÁF.
SAF-A-LLOY 426-454 219-235 X X   X Special alloy developed for general use where lead free solder is mandated.
OTHER ALLOYS              
Sn62Pb36Ag02 354-372 179-189 X X X X Used on silver coated ceramics and PdAg substrates, prevents silver leaching.
Sn60Pb36Ag04 354-475 179-246 X X   X Used on silver coated ceramics and PdAg substrates, prevents silver leaching.
Sn10Pb88Ag02 514-570 268-299 X X X X Used in products that operate in high ambient temperature environments.
Sn05Pb93.5Ag1.5 565-574 296-301 X     X Used in products that operate in high ambient temperature environments.
Sn05Pb92.5Ag2.5 536 280 X X   X The highest temperature, eutectic alloy available from Kester.
Sn43Pb43Bi14 291-325 144-163 X X X X Used in low temperature electronic assembly applications.
NOTES:
  C = (5/9)(F-32)
  F = (9/5)C + 32
  K = C + 273.15
SOURCES:
  1. Alloy Temperature Chart
  2. A Word About Solder


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