ALLOY |
MELTING
RANGE |
AVAILABLE
FORMS |
|
TIN-LEAD |
ÁF |
ÁC |
WIRE |
BAR |
SOLDER
PASTE |
SOLDER
FORMS |
RECOMMENDED
USE |
Sn63Pb37 |
361 |
183 |
X |
X |
X |
X |
Most common, tin-lead eutectic used in PCB assembly applications. |
Sn60Pb40 |
361-374 |
183-190 |
X |
X |
|
X |
Used in single sided board soldering and solder dipping operations. |
Sn55Pb45 |
361-374 |
183-203 |
X |
X |
|
X |
Not commonly used, solder for high temperature solder dipping operations. |
Sn50Pb50 |
361-397 |
183-214 |
X |
X |
|
X |
Intended use for bit soldering and sweat soldering iron, steel, and copper. |
Sn40Pb60 |
361-420 |
183-238 |
X |
X |
|
X |
Higher temperature applications, common in automobile radiator soldering. |
Sn30Pb37 |
361-460 |
183-258 |
X |
X |
|
X |
Use as automotive body solder for filling dents. |
No. 123 |
366-496 |
186-262 |
X |
X |
|
|
Low drossing alloy used in high temperature wire tinning operations. |
Sn20Pb80 |
361-503 |
183-280 |
X |
X |
|
X |
Not commonly used, solder for automotive body or radiator work. |
Sn10Pb90 |
514-536 |
268-302 |
X |
X |
|
X |
Alloy of choice for solder spheres and columns used in BGA/CGA fabrication. |
Sn05Pn95 |
574-576 |
301-314 |
|
|
|
X |
High temperature alloy used infrequently in special applications. |
LEAD-FREE |
|
|
|
|
|
|
|
Sn96.5Ag3.5 |
430 |
221 |
X |
X |
X |
X |
High temperature, eutectic alloy provides high joint strength. |
Sn96Ag04 |
430-444 |
221-229 |
X |
X |
|
X |
This alloy is used in applications where high joint strength is required. |
Sn95Ag05 |
430-473 |
221-245 |
X |
X |
|
X |
This alloy is used in applications where high joint strength is required. |
100%Sn |
450 |
232 |
X |
X |
|
X |
Sometimes referred to as Sn99, is used for making tin additions to solder pots. |
Sn95Sn05 |
450-464 |
232-240 |
X |
X |
|
X |
For applications where connections see peak temperatures near 400ÁF. |
SAF-A-LLOY |
426-454 |
219-235 |
X |
X |
|
X |
Special alloy developed for general use where lead free solder is mandated. |
OTHER
ALLOYS |
|
|
|
|
|
|
|
Sn62Pb36Ag02 |
354-372 |
179-189 |
X |
X |
X |
X |
Used on silver coated ceramics and PdAg substrates, prevents silver leaching. |
Sn60Pb36Ag04 |
354-475 |
179-246 |
X |
X |
|
X |
Used on silver coated ceramics and PdAg substrates, prevents silver leaching. |
Sn10Pb88Ag02 |
514-570 |
268-299 |
X |
X |
X |
X |
Used in products that operate in high ambient temperature environments. |
Sn05Pb93.5Ag1.5 |
565-574 |
296-301 |
X |
|
|
X |
Used in products that operate in high ambient temperature environments. |
Sn05Pb92.5Ag2.5 |
536 |
280 |
X |
X |
|
X |
The highest temperature, eutectic alloy available from Kester. |
Sn43Pb43Bi14 |
291-325 |
144-163 |
X |
X |
X |
X |
Used in low temperature electronic assembly applications. |