Dr. Douglas A. Buchanan, Ph.D., P.Eng., FCAE

Professor, Electrical and Computer Engineering, University of Manitoba.

Education

  1. ✦ Ph.D. in Applied Physics and Electronics, University of Durham, Durham, England, 1986.

  2. ✦ M.Sc. in Electrical Engineering, University of Manitoba, Winnipeg, Canada, 1982.

  3. ✦ B.Sc. in Electrical Engineering, University of Manitoba, Winnipeg, Canada, 1981.


Previous Positions

  1. ✦ Vice-president, Commercialization, Innovate Manitoba, 2012 – 2014.

  2. ✦ Acting Dean, Faculty of Engineering, University of Manitoba, 2010 – 2011.

  3. ✦ Associate Dean - Research, Faculty of Engineering, University of Manitoba, 2009 – 2010.

  4. ✦ Canada Research Chair Tier II - Microelectronic Materials, 2003 – 2013.

  5. ✦ Associate Professor, Department of Electrical and Computer Engineering, University of Manitoba, Canada, 2002 – 2003.

  6. ✦ Research Staff Member, IBM - Thomas J. Watson Research Center, NY, USA, 1991 – 2002.

  7. ✦ Staff /Advisory Engineer, IBM – Microelectronics Division, NY, USA, 1988 – 1991.

  8. ✦ Post-doctoral Fellow, IBM - Thomas J. Watson Research Center, NY, USA, 1986 – 1988.

  9. ✦ Lecturer (Asst. Professor), Dept. of Applied Physics and Electronics, University of Durham, Durham England, 1983 – 1986.

  10. ✦ Research Assistant, Dept. of Applied Physics and Electronics, University of Durham, Durham England, 1982 – 1983.

Most Significant Contributions to Research and/or to Practical Applications

  1. ✦ Defect Analysis for Advanced CMOS High-κ Gate Dielectric Stacks.

  2. ✦ First high-k gate insulator, poly-silicon gate, sub 0.1 μm (80 nm gate length) FET.

  3. ✦ Quantum-mechanical tunnelling in ultra-thin gate dielectrics.

  4. ✦ Silicon dioxide degradation due to hydrogen and “hot” electrons.

  5. ✦ Tungsten (mid-gap) metal gates for ultra-thin dielectrics.

Awards

  1. ✦ Students Teacher Recognition Award, “For Significant Contributions to Excellence in Teaching”, University of Manitoba, 2007.

  2. ✦ IBM-Research Division Award, “For contributions to the development of a low-temperature plasma-enhanced-vapor-deposition process for fabricating silicon-dioxide films”, 1988.

  3. ✦ Outstanding Technical Achievement Award, “For studies of the release and subsequent motion of hydrogen in electrically stressed silicon dioxide films”, 1992.

  4. ✦ General Manager's Teamwork Award (Microelectronics Division), “For research and development on Dielectric Reliability and its application to future CMOS processes”, 1997.

Professional Memberships

  1. ✦ Senior Member of the IEEE.

  2. ✦ Member of the American Institute of Physics.

  3. ✦ Member of the Association of Professional Engineers and Geoscientists of the Province of Manitoba (APEGM).

Editorial Duties

  1. ✦ Editor of the IBM Journal of Research and Development (Vol. 43, No. 3, 1999) special issue on Ultra-thin dielectric films.

  2. ✦ Editor of the symposium proceedings of Structure and Electronic Properties of Ultra thin Dielectric Films on Silicon and Related Structures, MRS Meeting, Boston Massachusetts, November, (1999).

Conference/Meeting Organization

  1. ✦ Co-Chairman for Materials Research Society (MRS) symposium on Structure and Electronic Properties of Ultra thin Dielectric Films on Silicon and Related Structures, Boston Massachusetts, 1999.

  2. ✦ Technical committee member (1991-95), Arrangements Chairman (1995), Technical Chairman (1996) and General Chairman (1997) of the IEEE Semiconductor Interface Specialists Conference, held annually in December.

  3. ✦ Co-chairman for the Semiconductor Research Corporation, Topical Research Conference (TRC) on Ultra-thin Dielectrics at Durham, NC, USA, 1996.

Reviewer for Journals

Journal of Applied Physics

Applied Physics Letters

American Institute of Physics - Physical Review B

Physical Review Letters

IEEE – Transactions on Electron Devices

Electron Device Letters

IEEE Proceedings

Others: Thin Solid Films, Solid State Electronics, J. Electrochemical Society, Journal of Vacuum Science and

Technology, IEE Electronics Letters

Setting Roadmaps and Guidelines

Founding member of SEMATECH’s (SEmiconductor MAnufacturing TECHnology, a consortium, of microelectronics companies, formed in 1987, for solving common manufacturing problems) Gate Stack Engineering Working Group from 1992-2000 who’s responsibility was, and still is, for setting guidelines for “gate-stack engineering” via the International Technology Roadmap for Semiconductors (ITRS) for future microelectronics manufacturing.


Top